By Thomas Dietrich
Chapter 1 effect of Microtechnologies on Chemical Processing (pages 3–28): Jean F. Jenck
Chapter 2 Microreactors created from metal fabrics (pages 31–46): Frank N. Herbstritt
Chapter three Microreactors created from Insulating fabrics and Semiconductors (pages 47–64): Norbert Schwesinger and Andreas Freitag
Chapter four Micromixers (pages 65–86): Joelle Aubln and Catherine Xuereb
Chapter five Microchannel warmth Exchangers and Reactors (pages 87–129): Mark George Kirby and Svend Rumbold
Chapter 6 Separation devices (pages 131–163): Asterios Gavrlllldls and John Edward Andrew Shaw
Chapter 7 Calculations and Simulations (pages 165–184): Dieter Bothe
Chapter eight Dosage apparatus (pages 187–197): Aslf Karlm and Wolfgang Loth
Chapter nine Micromachined Sensors for Microreactors (pages 199–244): Jan Dziuban
Chapter 10 Automating Microprocess structures (pages 245–264): Thomas Muller?Heinzerling
Chapter eleven techniques for Lab?Scale improvement (pages 267–283): Dirk Krischneck
Chapter 12 Microreaction platforms for schooling (pages 285–298): Marcel A. Liauw and Dlna E. Treu
Chapter thirteen Microreaction platforms for Large?Scale construction (pages 299–323): Anna Lee Y. Tonkovich and Eric A. Daymo
Chapter 14 procedure Intensification (pages 325–347): Michael Matlosz, Iaurent Falk and Jean?Marc Commenge
Chapter 15 Standardization in Microprocess Engineering (pages 349–357): Alexis Bazzanella
Chapter sixteen Polymerization in Microfluidic Reactors (pages 361–383): Eugenia Kumacheva, Hong Zhang and Zhihong Nie
Chapter 17 Photoreactions (pages 385–402): Teijiro Ichimura, Yoshihisa Matsushita, Kosaku Sakeda and Tadashi Suzuki
Chapter 18 Intensification of Catalytic method by means of Micro?Structured Reactors (pages 403–430): Lioubov Kiwi?Minsker and Albert Renken
Chapter 19 Microstructured Immobilized Enzyme Reactors for Biocatalysis (pages 431–447): Malene S. Thomsen and Bernd Nidetzky
Chapter 20 Multiphase Reactions (pages 449–474): J. G. E. Han Gardeniers
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Additional resources for Microchemical Engineering in Practice
74'. In that case, all free-standing (001)planes will be etched as a kind of deep etching. If the surface is covered with a masking material, etching is possible only inside the windows of the mask. Etching stops at all (1 11)-planes that intersect, as the last plane, the window edge. Deep etching continues as long as (001)-planes remain. Consequently, one achieves rectangularly shaped deep etched structures with tilted sidewalls. 74'. When etching is continued until the last (100)-plane has disappeared, the tilted sidewalls intersect each other and the etching stops .
PHPSESSID=e8b7 ef919907a581959f42cc890a8511. 23. Chemie Ingenieur Technik, 5 (May 2005),77. 24. Chemical & Engineering News (May 2005), cover story. 25. shtml. 26. P. Pennemann, V. Hessel, and H. Lowe, Chem. Eng. , 59 (2004), 4789-4794. 27. D. M. Roberge, L. Ducry, N. Breler, P. Cretton, and B. Zimmerman, Chem. Eng. , 28(3) (2005),318-323. 28. U. Krtschil, V. Hessel, D. Kralisch, G. Kreisel, M. Kupper, and R. Schenk, “Cost Analysis of a Commercial Manufacturing Process of a Fine Chemical Using MicroProcess Engineering,” CHIMIA, 60(9) (2006).
As a doped semiconductor, single crystalline Si is the basic material in microelectronic technology. Along with its excellent electrical properties, it also has outstanding mechanical and thermal properties. Although microelectronic circuits occupy only areas near the surface of the silicon, the use of other properties is connected with complete volume usage. This restriction had to be overcome by suitable three-dimensional structuring technologies. It was only a question of time before mechanical products of crystalline silicon would be launched in the market.
Microchemical Engineering in Practice by Thomas Dietrich