By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent details on a mainstream approach that's severe for high-volume, high-yield semiconductor production, or even extra in order gadget dimensions proceed to decrease. The know-how has grown to surround the removing and planarization of a number of steel and dielectric fabrics and layers either on the gadget and the metallization degrees, utilizing various instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This vital booklet bargains a scientific evaluation of basics and advances within the zone. half One covers CMP of dielectric and steel motion pictures, with chapters targeting using specific innovations and techniques, and on CMP of specific quite a few fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP approaches.
Part addresses consumables and method regulate for stronger CMP, and contains chapters at the practise and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor methods, and techniques for defection characterization, mitigation, and reduction.
- Considers recommendations and approaches for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and technique regulate for more desirable CMP